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Mobile Chip Level Training

Mobile phone  Repair Training in Nepal is the most relevant and necessary training in today’s world. As everyone carries mobile phones and trustful repairing is always an issue. In today’s world, it’s hard to find people without smartphones since it has been part of our life. With the pace of technology, there is a need for professionals who can address the issue. People always seek for a reliable place to find and solve the problem of new technology.

We provide the best mobile repair training in Kathmandu. We provide training in major cities like Pokhara, Dhangadi, Butwal and other cities. We provide reliable services to fix the problem. Guru has professional teachers and equipment to train students. GURU pioneers in Smart Technology and Engineering with a ‘Skill Development Program’. We providing opportunities to learn via live project exposures and real-time working culture. Guru is always head in mobile phone repair training in Kathmandu.

We follow the standard operating procedures “SOPs”. The device is checked, diagnosed, evaluated for cost. After that, the required services are executed. Software problem troubleshooting, hardware repair are executed. After that, test the faulty set and finally time stamp to claim the warranty period. We infix the latest version device software, firmware, repairing components. The component is resistors, capacitors, and IC (Integrated Circuit) chips from trusty vendors. We follow an international practice through which students can practice their skills anywhere. The students from GURU can compete around the world without getting biased.

We welcome everyone willing to join our academic training chip level repairing program. There is no bound to those willing to study. There are no criteria to join our program. Yet, a small skill test is conducted and counseling is done. The test is taken to help the students reach their goals and strengthen their weaknesses. After that classes of different modules are undertaken followed by the tests. Finally, the student is allowed to work as “On the Job Training” practitioner in a service center. Students here could master their mobile repairing skills in the relevant domain.

Syllabus

Introduction To Mobile Communication
History of mobile communication
GSM (Global System For Mobile Communication)
GSM &CDMA – Different bands
Duplexing – Uplink & Down Link Frequencies.
3G Network – WCDMA & CDMA 2000 ,4g networkingMultiplexing methods (Cellular Communication)
SDMA – Space Division Multiple Access _Cell Concept
FDMA –Frequency Division Multiple Access – Channels
TDMA – Time Division Multiple Access (Time Sharing)
CDMA – Code Division Multiple Access – spread spectrum method
Advantages And Disadvantages Of Cell ConceptNetworking (GSM CDMA & WCDMA)
Network Components – BTS, BSC, MSC, Link Towers – Repeaters
BTS – Base Transceiver Station, BSC – Base Station Controller
HLR ,VLR, EIR, SMSC, AUC, Voice Message Centre
Antenna – Low Power, High Power, Coverage, Repeater, Microwave Links
Power Variation in Antenna for Different Bands.
Auto Power Controlling In Mobile Phone According To Distance from BTS
Mobile initiated call – key of security – Diagram
Communication (link) between cellular network and other networks
Cell Broadcasting (CB), Cell Info DisplayIntroduction To Mobile Phone
Mobile Phone – IMEI Number
Manufacturing Companies And Mutual Understanding With Network Providers.
N/W Service Provider , N/W Technology Provider.
Transmitting Power Of Mobile Phone – GSM & CDMA
MS – Mobile Station – Mobile Phone + SIM
Securities Used In Mobile Phone For User [Security Code, Keypad Lock, Call Baring, Pattern lock],
Mobile phone pricing.SIM – Subscriber Identity Module
SIM – block diagram
SIM Contents, SIM Capacity, IMSI, PIN , PUK, Multi SIM packages
Working Voltage and clock for SIM.Features Provided By N/W Provider
SMS ,MMS, Voice Message, Call Barring, Call Diverting, Call Waiting ,Call Conferencing, Fixed Dialing ,CUG etc.
GPRS, EDGE, HSCSD, GPS Navigation Services, Television channels , Mobile Banking ,Tablet PC servicesDifferent Modes Of Operations & Battery
Watch Dog – Purpose
Need Of Current Measurement In Service Field.
Main battery and RTC back up battery.
Sensing Points In Battery [Temperature, Over Voltage Etc.) & Complaints
Original And Duplicated Battery Comparison And Complaint Due To Duplicate BatteryDifferent Types Chargers
Types of chargers- travel, USB, Ampere rating of chargers
Minimum Voltage For Charging ,New Battery Charging
Battery Low Indication, Battery boosting, Cut off Circuit Using In BatterySMT & SOC Systems – Revision
Current consumption , Temperature Handling , Soldering Details
MCP – (multichip packages) , Modules , BGA – Ball Grid Array, POP
Types Of BGA – Temperature Ratings
Multi Layer PCB’sIntegrated Circuits
DC to DC Converters , N/W IC’s, Microprocessor, Memory IC’s, sensors, Filters, MCP,MML
Bluetooth , Wi-Fi , FM IC’s, SIM, SIM EMIF (Glass IC-Diode Array, Resistor Array)
Pin Configuration of SMD IC’sBGA
Types of BGA, Pin Configuration of BGA IC’s
Points Remember While Handling BGA
POP – Package On PackageHardware Of Mobile Phones
Simple block diagram of mobile phone
Detailed block diagram
SOC(System on chip) ,Embedded System
Power Supply Section, N/W Section ,Data Processing Section
Display Section, UI Section (User interface Section)
Audio Section- Mic speaker, ringer, vibrator
Other wireless sections
Sensors in mobile phone

Introduction to Electronics
Application of Electronics
Concept of matter
Atomic structure
Conductor, Semi- conductor, Insulator
Electric charge, Potential difference, Electric current, Electrical energy, Electrical power
Resistance
Measuring units
Types of current
Direct current, Alternating current
Wave length, Cycle, Frequency, Amplitude
Voltage Sources
AC &DC voltage source
Measuring instruments, Multimeter
Ohm’s Law –simple Calculations
Voltage, Current, Resistance, Power Relations
Voltage & Current Measurement (breadboard)
Electronic Components
Passive &Active Components
SMT,SMD
SMT- advantages
Resistors
Fixed –types, Specifications
Variable –types
Array
Colour coding
TDR (Thermister) ,LDR ,VDR
SMT resistors and Parallel & Series resistors
Current ,voltage measurement
Capacitors
Capacitance, Capacitor value
Capacitive Reactance
Specifications of Capacitor
Parallel & Series -coupling, filtering, bypassing
Fixed –Ceramic Capacitor, Mica Capacitor
Polyester Capacitor, Paper Capacitor
Electrolytic Capacitor (Aluminium, Tantalum)
Variable – types
SMT capacitors -Applications in Laptop (tank capacitor, EMIF, Sensor)
Dummy capacitors
Components checking using multimeter
Inductors
Inductance, Inductive reactance
Self inductance & mutual inductance
Inductor- types (application base only)
Comparison between Capacitors & Inductors
Transformers, Specification
Step up Transformers, step down Transformers, Tapped Transformers
AC, chokes. Filters
SMT inductor and applications
Checking using Multimeter
FiltersSemi Conductors
N-Type & P-Type Semi Conductors
P-N junction, Biasing
Semi conductor Diodes
Diode – working, Specification
Classification of Diodes
Zener diode Voltage Regulator
SMT diodes and applications
Checking using Multi meter
Checking using by component Tester
DC Voltage source
Cell
Primary & secondary cell
Voltage & current rating of CellCombination of cell
Battery- Series, & Parallel
Back up time & Charging time
Battery boosting
Battery
Battery -PPT
Types Of Battery, NiMH – NiCd, Li-Ion, Li-Polymer, Poly ascene.
Li-Ion & Li-Polymer – Protection Circuit
Advantages and Disadvantages.
AC to DC converter
Rectifiers & filters
Different types of Rectifiers (Half wave & Full wave)
ApplicationsTransistor
NPN & PNP Transistor
Transistor as a switch
Transistor as Amplifier
Different types of amplifiers – AF,RF,IF
Voltage amplifiers(pre-amp) and Power amplifiers
Multistage amplifiers (Ex: PA)
Tuned amplifiers
Comparison – FET, JFET & MOSFET
Advantages &disadvantages
SMT transistor-introduction and application
Checking using Multi meterIntegrated circuit
Classification of IC , Advantages of IC
IC package – (PPT)
SOC, Multi chip package
Components array
Digital electronics
Introduction (comparison between analog & digital)
Logic gates
AND, OR, NOT
Flip- Flop, Multiplexers, De multiplexers
Memory- Classification
RAM, ROM, EEPROM
Flash Memory, OTP

Charging section(all models)
Components Used In charging Section, Charging indication, charging controlling
Temperature sensing, BSI
Energy management IC
USB charging
Power management section
Power saving mode in mobile phone.
Components Used In Power Section
Power distribution, Core Voltages
DC- DC converters(SMPS IC), regulators
Block diagram of UEM, RETU, AVILMA and others
Temperature, Over Voltage and Low – Voltage Cutoff For Battery.
BSI, B-Temp Circuit on Board , Sensing Point Complaints
current sensing resister
Pull up and pull down resistor
On-Off Section Working (different models such as Nokia, Samsung, Sony Ericsson..))
Complaints Due To On-Off Circuit
RTC & Backup Battery
External Power Supply to Mobile Phone – Sensing Circuit
Tracing and Voltage checking
Complaints in charging and power sections
Block Diagram of Data Processing Section
CPU – Single engine, Dual engine
Different Processors –,Samsung, Sony , iphone, oppo
Single and Dual Operating Systems
Clock Signal For CPU – main crystal and RTC, CPU Speed
Core voltage supply
DSP – Digital Signal Processor , Block Diagram Of Digital Modulation
Memory section
RAM ,ROM,E2prom and Flash -common Complaints
MCP (multi chip packages) or MML (merged memory logic) or Combo memory.
Memory capacity checking from serial number
Internal mass Storage , Extended memory (Memory card section)
SIM section -SIM Related H/W Complaints , SIM Related Error Messages.Mobile Software’s
System Software (Operating System) – Types of operating systems
Dual engine operating systems (System OS + Application OS)
API (Application Peripheral Interfere) , Domestic OS (does not support API)
Data Exchange Software (PC suites)Mobile phone software upgrading
Service Software’s – Unlocking / Repairing
Flashing – different methods ,Flashing Boxes & Dongles,
Tracing and Voltage checking
Error Messages For H/W Complaints While Using Boxes
Network Section
Block Diagram explanation , Basic block diagram
RF Section and IF Section
Antenna , External Antenna, Antenna Switch (Tx / Rx),FEM
Pre-Amplifiers & RF Power Amplifier (TX)
LNA – RF Amplifiers ,RF Signal Processor
VCO,Supply To VCO
Crystal Oscillator , Frequency Synthesizer – working
Crystal ,Coil Filters ,Mutual Couplers(RF transformers)
Tracing and Voltage checking
Common Complaints
Audio Section
Explanation Of Audio Section In Different Models – Audio IC
MIC – Types, Crystal & Digital mic
Noise cancellation & multimedia mic
Speaker ,Ringer, Vibrator ,Audio amplifiers (ICs) ,Hands free – Types – WorkingDisplay Section
Liquid Crystal Display – LCD Drivers ,LCD Connectors
Organic Led (O Led) ,examples
Touchpad- types of touch pad(resistive, capacitive), Multy touch
Backlight driver circuit in different models
Back light brightness controlling (ambient light sensor)
Tracing and Voltage checking
Common complaintsKeypad Section
Keypad, Backlight
Flip Keypad Activation
Joystick, Track ball, Touch Sensitive Keypad, optical touch pad
Camera Section
Camera –types ,camera working voltages
Resolution , digital &optical zooming
Camera flash light driver circuit
Sensors
Hardware details
Tracing and Voltage checking
Common complaintsAdvanced Technologies In Mobile Communication
Convergent technology – TV, Projector, internet, GPS ……
GPRS EDGE ,HSCSD,3G
Blue Tooth ,Wi-Fi, DLNA, Wi-Max
Wi-Fi hot spot in mobile phone
GPS & Navigation on Mobile phone
Short range wireless sections in mobile phone -Hard ware details
FM , Wi-Fi, Blue tooth, GPS
IPhone , Blackberry
HTC,SONY
Dead set repairing procedure
Data backup and recovery method

In this module, students will get an opportunity to get internship in different mobile service centre inside valley and outside valley.
Checking Cell phone Schematic through advanced tools and softwares
EMMC programming
iPad Icloud Erasing
Padlayout

FAQ

Guru Institute is a place where a competent technician is born. We have the latest devices and software’s to troubleshoot and repair all the devices. We have professional equipment and teachers. Teachers here are with years of experience. So, our students can learn to diagnose the fault in a systematic pattern and fix the problems. The reason why you must choose Guru for Mobile repairing training. The following points are the reason that one should choose the GURU.

Training in sophisticated devices and advanced handsets
100% job oriented courses on smart hardware and networking
Molding each candidate to become a Techno Entrepreneur
Achieved 100% Placement record in 2017/2018
Building Technical manpower for nation-building
25+ Care centers all over Nepal and 3 Branches
Scholarship for deserving candidates
Real-time hands-on practical learning
Career counseling and Guidance

Servicing in Card Level L1: 30 Hrs.
Basic Electronics L2: 30 Hrs.
Circuit/Schematic Analysis L3: 30 Hrs.
BGA Rebelling L4: 30 Hrs

Mobile training at our center GLabs provides real-time hands-on works on industry live projects.
We make sure the theory is well understood showing a real-time demonstration. We here teach in practical ways where they are to be implemented in projects

Students at our training center could get the realization of the real-time project. Also, work handling is like the operations executed in industries. With our industry-oriented globally updated syllabus, students would not get any significant challenges after joining the mobile training students. We provide opportunities to deserving students in different companies.

The students also get the opportunity to show their project works as part of tech talks. Students from GURU are in different honored companies around here in Kathmandu and other different cities.

With the growth of development in the digital world, every people carries mobile phones. As a good mobile repair expert, it is crucial to have knowledge related to mobile phones. In this regard, the trends in adopting the challenges of mobile repairing are becoming very popular.

The trends seem to be growing day by day as mobile products are revolving quite flexible. This is too attracting the students to learn mobile repair training. This seems to be one of the promising and growing IT carrier market. Guru is facilitating mobile training with the use of a very competitive syllabus and technology.

Every week new models of phones are launching and new mobile brands are rising up. Thus, there is no lack of workspace for ambitious mobile repair engineers. Smartphone repair engineers find lots of spaces to work after completing mobile repair training.

The triviality of this industry is also the result of increased internet and technology. Students will find more people being reliant on their phones as time passes by. It is all the information we need and our road to communication into this device. That is possible as well as practical to have mobile phone training in Kathmandu. If someone seeks to have a career with growth possible, then this is the right option for them. Some of the possible opportunities in Mobile Phone Repair training are pointed below:

Freelance repair engineer
Service Support Engineer
Phone repair tech and consultant
Smartphone repair shop
Technical Support Engineer
Start a repair shop of own
General service center
Tutor at any institute
Servicing store of the cellphone company

Deals with repairing of the branded mobile phones. Such as iPhone, Samsung Galaxy Series, MI, Micromax, MottoG, Oppo, Colors, LG, Nokia, Lenovo, etc.
Provide mobile software solutions. Such as the unlocking of mobile devices such as iPhone, Samsung Series, etc.
Experts in data recovery services of iPhone and other Android phones.
Provides Icloud solutions for apple devices such as iPhone, iPad, Mac
Provides repairing technicians as pay on-demand basis.
Provide the best opportunity to gain real-time experience in troubleshooting and fixing mobile.
Guru has a mission to enhance the youth in skill development programs.
Students learning at Guru are capable of establishing their own mobile technology business. 100% of the students are working in service centers in different places.
Students can work under a globally competent mobile repairing market.
Practical means profitable
Industry expert Mobile training instructors
Practice mobile repairing labs using the best equipment.
100% hands-on mobile phone repair training
Paid internship in our many guru care centers in Kathmandu and outside valley.
Repair circuits on the extra basis for the latest technology updates.
Share knowledge on reading schematics.
We also provide Advanced Chip level Laptop Repairing & Training Services in Kathmandu.

Success Story

Anil Acharay

Working In:
Atm computer & Electronics Gaira Patan pohara
Position:
Junior Technician

Basanta Bhattrai

Working In:
Spring computer Educational Institute
Position:
Head Technician

Bhawan Mani Poudel

Working In:
Barahakshetra It Office Link
Position:
Technician

Abiral Bhandari

Working In:
Wenddy House School
Position:
Technician
Quick Enquiry
Phone Numbers +977-01-4482357, +977-9851209564
Facts

Course Features

Duration
Caree Level Mid Level
Assesement Yes
classes

Upcoming Classes

13/10/2020
-
certification

Certifications

Testimonials

Our Testimonials

Namaste. Me Sandesh Manandhar, I was a student and a trainee at GURU Institute of Engineering and Technology. I found the comfortable environment and well managed training lab to achieve the target I had set. The experienced teacher with well managed lab helped me a lot.

Sandesh Manandhar
Sandesh Manandhar
Hardware Technician

Knowledge is a thing and using that knowledge to change the prospective of yourself of admiring and analyzing the world is another. This is how Guru has provided me with the knowledge and skills in the field of chip level engineering so that I am able to compete with the challenge in the current blooming market of this field.

Kripesh Shrestha
Kripesh Shrestha
Chip Level Export
Device Hub

Hi everyone, I have done Chip Level Training at GURU Institute of Engineering and Technology. I found that GURU is the best place to train our mind and get excellence in what we want to crave. I was struggling to find the hardware training institute in Kathmandu.

Dibyashwor Baral
Dibyashwor Baral
Chip Level Expert
Expert IT Solution

Hello Everyone, I am Suraj. I had hardware training in Kathmandu Nepal at Guru and found it very friendly. At last, I found Guru is the place to develop the skills, knowledge and gain experience in chip level hardware training. Now I am BT care center working as senior mobile technician.

Suraj Bastola
Suraj Bastola
Senior Technician

Hello all, myself Ranjan Sapkota currently working as Sr. Network Technician at Mercantile communication system pvt. Ltd. I’m able to do this because of the network training I received from GURU Institute of Engineering and Technology. GURU is the place where we can learn what we want to learn.

Rajan Sapkota
Rajan Sapkota
Hardware & Network Technician.
Mercantile communication system pvt. Ltd
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