Laptop Repair Training and Laptop Chip Level Training

Be Trained by Industry Leaders and Experts

Course Overview

Laptop repair training has been the most important need in today’s market. With the increasing use of laptops, we should have our laptop in proper condition. It has found that there is no proper facility for laptop repairing in Kathmandu and all over Nepal. The laptop is an asset for the peoples like us and it should last long without any sorts of problems.

Nowadays Laptop repair training courses are one of the most ambitious courses. Withdrawing minds of many electronics diploma graduates to graduate computer and electronic engineers. Rising buyers of laptops increase the demand for skilled laptops Engineers in maintaining.

The IT industry is a high demanding chip level repairing expert Engineer. But, still, there is a lack of expert engineers in the market. We are bridging the gap by producing expert laptop engineering in real-time problems.

GURU provides Laptop repair training in Kathmandu with experts. We repair every brand of the laptop with great efficiency and care. According to the research done in the Nepalese market of laptop and desktop. We found that there is a huge demand for laptop repairing centers in Kathmandu with and experts.

Laptop Repair Training at GURU

We bring global learning experience in Laptop Chip Level Engineering and research. With our deep 12 years of the learning experience in the field of Laptop maintenance. Finally, we launched courses from beginner to advance chip level circuit design.

We provide full practical courses with a globally updated syllabus. Under the team of experienced service-center Engineers’ in advanced full equipped innovation Laboratory. GURU’s best syllabus of explains the accurate theory. The syllabus covers essential tips for candidates to fix every problem of Laptop repairing.

Servicing in Card Level L1 – Laptop Repair Training


This is a Basic Laptop repair training level-1 outline Customized syllabus for beginner level students

A. Computer Hardware and Parts details in laptop repair training

Difference between Laptop and Desktop

  • ASSEMBLE D-ASSEMBLE Demo with Parts Identification,
  • ADAPTER: Work, Types, Working Concept, Volt, Ampere, PIN, Checking
  • BATTERY: Types, Cell, Pinout Detail, Basic Problem,
  • TFT/LCD: Type of LCD, TFT/LCD, size, pin, wide, CCFL
  • INVERTER: Usage of Concept of Inverter,
  • Motherboard: Types, Block Diagram, Identify
  • CPU: Types, Block Diagram, Identify
  • KEYBOARD: Types, Working Concept
  • HARD DISK: Types, Diagrams, Basic Problems
  • RAM: Types, Working Concept, Basic Problems
  • CD/DVD: Types, a common fault
  • ASSEMBLE/De-ASSEMBLE DIFFERENT MODELS

B. The detailed structure of motherboard in Laptop Repair Training

  • Block diagrams of Laptop Motherboards, Understand the different chips of Laptop Motherboard
  • Block diagram of laptop motherboard
  • Notebook frame structure
  • Types of Intel platform
  • Type of AMD platform
  • Difference between difference platform
  • Connection of different chip, Address bus, data bus, a control bus, etc.
  • Clock generator (ICS, Cypress or ICW, Win bond, IMI)
  • CPU Types (Pentium, Celeron, series)
  • North Bridge Chips (NFORCE, AMD, SIS, VT, I845, I875)
  • SouthBridge Chip (IS, VT, INTEL, NVDIA, VIA, IBM, FBM, GBM,
  • PCH(HM55, HM 65, SLj8e)
  • Single-chip
  • Graphics chips (Nvdia, ATI, GForce AMD)
  • USB 2, Webcam, Bluetooth, SATA, HDD, LPC Bus, Mini PCI slot
  • Card bus connection, Card Reader, Flash Rom, RTC LAN IEEE 1394
  • Internal CMOS battery RTC(real-time clock)
  • Audio Chips (ALC, AC, CX, TPA, RTL, STA, AMC, HD Audio Codec)
  • LAN/Ethernet Chip (Realtek, Broadcom, BCM, 3COM, LF, ATPL)
  • I/O CONTROLLER LPC/KBC (Winbond, ENE, KBC, ITE, WPC, PC, FDCLPC)
  • Touchpad, Internal keyboard, the connection inboard
  • Fan, Heat sink
  • Flash ROM BIOS (legacy, UEFI)
  • Different connectors and sockets internal & external
  • Modem Acc, RTL, CD ROM connection, HDD connection, monitor, USB,
  • PS2, audio jack, etc.
  • VGA connection, Key Board Connection, TouchPad Connection, Power
  • Board DVD Panel Top
  • Daughter Board

Bios Entering Keys of Different Model Laptops

  • Dell, HP, Lenovo, Acer, Toshiba, Samsung & Apple

Operating system Installation in Laptop Repair Training

  • Windows
  • MAC os
  • Linux
  • Driver Installation online and offline
  • Data Backup
  • Data Recovery

LAPTOP BEEP CODES – Laptop Repair training

  • Meaning of Beep
  • Symptoms of Beep
  • Postcode error of different debug card and BIOS

Debug Card Codes – Laptop Repair Training

  • Introduction to debugging cards
  • Types
  • Codes
  • Fault finds through Debug codes

Troubleshooting and Fault Finding –  Laptop Repair training

  • Hardware
  • Software
  • Networking
  • Circuit Board

Basic Electronics L2 – Laptop repair Training

Basic Electronics L2

  • Course Duration: 30Hrs

Introduction to Electronics

  • Application of Electronics

Concept of matter

  • Atomic structure
  • Conductor, Semiconductor, Insulator
  • Electric charge, Potential difference, Electric current, Electrical energy, Electrical power
  • Resistance
  • Measuring units

Types of current

  • Direct current, Alternating current
  • Wavelength, Cycle, Frequency, Amplitude

Voltage Sources

  • AC &DC voltage source
  • Measuring instruments, Multimeter
  • Ohm’s Law –simple Calculations
  • Voltage, Current, Resistance, Power Relations
  • Voltage & Current Measurement (breadboard)

Electronic Components

  • Passive &Active Components
  • SMT, SMD
  • SMT- advantages

Resistors

  • Fixed –types, Specifications
  • Variable –types
  • Array
  • Colour coding
  • TDR (Thermister), LDR, VDR
  • SMT resistors and Parallel & Series resistors
  • Current, voltage measurement

Capacitors

  • Capacitance, the Capacitor value
  • Capacitive Reactance
  • Specifications of Capacitor
  • Parallel & Series -coupling, filtering, bypassing
  • Fixed –Ceramic Capacitor, Mica Capacitor
  • Polyester Capacitor, Paper Capacitor
  • Electrolytic Capacitor (Aluminium, Tantalum)
  • Variable – types
  • SMT capacitors -Applications in Laptop (tank capacitor, EMIF, Sensor)
  • Dummy capacitors
  • Components checking using a multimeter

Inductors

  • Inductance, Inductive reactance
  • Self-inductance & mutual inductance
  • Inductor- types (application base only)
  • Comparison between Capacitors & Inductors
  • Transformers, Specification
  • Step-up Transformers, step down Transformers, Tapped Transformers
  • AC, chokes. Filters
  • SMT inductor and applications
  • Checking using Multimeter
  • Filters

Semi-Conductors

  • N-Type & P-Type Semi-Conductors
  • P-N junction, Biasing

Semiconductor Diodes

  • Diode – working, Specification
  • Classification of Diodes
  • Zener diode Voltage Regulator
  • SMT diodes and applications
  • Checking using Multimeter
  • Checking using by component Tester

DC Voltage source

  • Cell
  • Primary & secondary cell
  • Voltage & current rating of CellCombination of cell
  • Battery- Series, & Parallel
  • Back up time & Charging time
  • Battery boosting

Battery

  • Battery -PPT
  • Types Of Battery, NiMH – NiCd, Li-Ion, Li-Polymer, Poly a scene.
  • Li-Ion & Li-Polymer – Protection Circuit
  • Advantages and Disadvantages.

AC to DC converter

  • Rectifiers & filters
  • Different types of Rectifiers (Half wave & Full wave)
  • Applications

Transistor

  • NPN & PNP Transistor
  • Transistor as a switch
  • Transistor as Amplifier
  • Different types of amplifiers – AF, RF, IF
  • Voltage amplifiers(pre-amp) and Power amplifiers
  • Multistage amplifiers (Ex: PA)
  • Tuned amplifiers
  • Comparison – FET, JFET & MOSFET
  • Advantages &disadvantages
  • SMT transistor-introduction and application
  • Checking using Multimeter integrated

 circuit

  • Classification of IC, Advantages of IC
  • IC package – (PPT)
  • SOC, Multi-chip package
  • Components array

Digital electronics

  • Introduction (comparison between analog & digital)

Logic gates

  • AND, OR, NOT
  • Flip- Flop, Multiplexers, Demultiplexers
  • Memory- Classification
  • RAM, ROM, EEPROM
  • Flash Memory, OTP

Circuit/Schematic analysis L3

What is PCB?

  • Single-Sided (only one layer).
  • Double Sided (two layers).
  • Multi-layer (more than two layers).
  • Schematic Reading and Circuit analysis
  • Component code in schematic
  • Schematic symbol
  • Introduction to Basic Circuit Design Process
  • Types of Printed Circuit Board
  • PCB Layers
  • Voltage, Data, Signal, Impedance and ground layer
  • Introduction to quanta, Compal, Foxconn and dell schematic

The power distribution of motherboard

  • Voltage Rails S0, S3, S4/S5  states
  • Always
  • Run Voltage
  • Suspend Voltage
  • SMBUS Control table

Laptop Power Up sequence

  • AC mode and DC mode
  • Pentium
  • Dual-core
  • I series – First Generation to  7th Generation
  • MAC Book and Tablet

Laptop Power Supplies

  • Introduction to Laptop Charging Section and working principle
  • Standby power supply
  • Ram Power supply
  • Terminate power supply (VTT)
  • ICH and GMCH power supply
  • PCH power supply
  • CPU (Core Supply, VCCP)
  • GFX Core Supply
  • Graphic Power supply (DPGU)
  • Transfer Power supply

DATA Allocation Table

CLOCK Allocation Table

  • Communication of Data and clock

DC Power Supply Introduction

  • Introduction
  • Types
  • Voltage, Amp  adjustment
  • Use A DC Regulated Power Supply Detect Shorted Component

Embedded Controller (EC, SIO, KBC & SMSC) Sections

    • INTRODUCTION
    • Relation with Supplies and Chip
      • PS2 Interface:-
      • SPI Device Interface
      • SPI Flash ROM
      • GPIO: PM_SLP_S3#, PM_SLP_S5#, EC_SMI#, MCH_TSATN_EC#, MINI1_LED#,  LOCAL_DIM, COLOR_ENG_EN, INVT_PWM, FAN_SPEED1, BT_ON#, ON/OFF, 30 PWR_SUSP_LED, WLAN_LED#, FSTCHG, BATT_GRN_LED#, BATT_AMB_LED#, PWR_LED, SYSON, , VR_ON ACIN, SATA_CLKREQ#, EC_SMI#, EC_SCI#
      • GPO: EC_RSMRST#, EC_LID_OUT# 22, EC_ON, EC_SWI# EC_PWROK, BKOFF#, WL_OFF#, EC_ACIN
      • GPI: PM_SLP_S4#, ENBKL, EAPD, EC_THERM#
      • SUSP# PBTN_OUT#, EC_PME#
    • SM BUS: SMB_CK1, SMB_DA1, SMB_CK2, SMB_DA2 Int. K/B Matrix
    • DA Output: DAC_BRIG, EN_DFAN1, IREF, CALIBRATE#
    • AD Input: ADP_I, BATT_TEMP
    • PWM Output: ADP_I, BATT_TEMP, ACOFF
    • LPC & MISC:    EC_GA20, EC_KBRST#, SERIRQ, LPC_FRAME#, LPC_AD0, CLK_PCI_LPC, PLT_RST#, EC_SCI#
    • ICH (South Bridge) SIGNALS
    • Power MGT: PBTN_OUT#, PM_DPRSLPVR,
    • PCI:  PLT_RST#, CLK_PCI_ICH
    • LPC:  LPC_FRAME# 29,
    • LAN/GLAN:  +1.5VS_PCIE_ICH, HDA_BITCLK_AUDIO
    • CPU: EC_GA20, H_A20M#, H_DPRSTP, H_DPSLP#, H_FERR#, H_PWRGOOD, H_IGNNE#, H_INIT#, H_INTR, EC_KBRST#, H_NMI, H_SMI#, H_STPCLK#, H_THERMTRIP#
    • IHDA: HDA_BITCLK_AUDIO, HDA_SYNC_AUDIO, HDA_RST_AUDIO, HDA_RST_AUDIO, HDA_RST_AUDIO, HDA_SDOUT_AUDIO
    • SATA: SATA_LED#, SATA_DTX_C_IRX_N0, SATA_DTX_C_IRX_P0, SATA_DTX_C_IRX_N1, SATA_DTX_C_IRX_P1, CLK_PCIE_SATA, CLK_PCIE_SATA,
    • HAD FOR GMCH: CLK_PCIE_SATA, CLK_PCIE_SATA, CLK_PCIE_SATA, CLK_PCIE_SATA,
    • SMB: ICH_SMBCLK, ICH_SMBDATA,
    • CLOCKS: CLK_ICH_14M, CLK_ICH_48M, SUSCLK,
    • sys/gpio: EC_SWI#, XDP_DBRESET#, PM_SYNC#, EC_LID_OUT#, H_STP_PCI#, H_STP_CPU#, H_STP_CPU#, ICH_PCIE_WAKE#, SERIRQ, EC_THERM#,
    • power mgt: PM_SLP_S3#, PM_SLP_S4#, PM_SLP_S5#, ICH_PWROK, PM_DPRSLPVR, PBTN_OUT#, CK_PWRGD
    • controller link:  CL_CLK0, CL_DATA0, CL_DATA0, CL_RST#0, EC_ACIN,
    • PCI express: PCIE_PTX_C_IRX_N, PCIE_PTX_C_IRX_P, PCIE_ITX_C_PRX_N, PCIE_ITX_C_PRX_P, PCIE_PTX_C_IRX_N, PCIE_PTX_C_IRX_P, PCIE_ITX_C_PRX_P, VR_ON, VGATE,
    • spi: SPI_CS#,
    • USB: USB_OC#, USB_OC#, Within 500 mils, MB USB Conn. USB/B, CMOS Camera, Card-Reader, USB/B, Bluetooth, MINI CARD,
    • direct media interface: DMI_MTX_IRX_N0 8
    • DMI_MTX_IRX_P
    • DMI_MTX_IRX_N
    • DMI_ITX_mrx_n ,  CLK_PCIE_ICH# ,
    • CLK_PCIE_ICH
    • host:  H_D#[0.., H_RESET#, H_CPUSLP#, H_ADS#, H_ADSTB#, H_ADSTB#, H_BNR#, H_BPRI#, H_BR0#, H_DEFER, H_DBSY#, CLK_MCH_BCLK, CLK_MCH_BCLK#, H_DPWR#, H_DRDY#, H_DRDY#, H_HIT#, H_HITM#, H_LOCK#, H_TRDY#, H_DINV#
    • H_DINV#
    • H_DINV#
    • H_DINV#H_DSTBN#
    • H_DSTBP#
    • H_DSTBN#
    • H_DSTBP#
    • H_DSTBN#
    • H_DSTBP#
    • H_DSTBN#, H_DSTBP#, H_REQ#, H_RS#,
    • DDR/CLK/controller/compensation: DDRA_CLK0
    • DDRA_CLK
    • DDRB_CLK
    • DDRB_CLK
    • DDRA_CKE
    • DDRA_CKE
    • DDRA_SCS
    • DDRA_SCS
    • DDRB_SCS
    • DDRB_SCS
    • DDRA_ODT
    • DDRA_ODT
    • DDRB_ODT
    • DDRB_ODT
    • clock: CLK_MCH_3GPLL
    • CLK_MCH_3GPLL
    • CLK_DREF_SSC
    • CLK_DREF_SSC#,  CLK_DREF
    • CLK_DREF_
    • DMI: DMI_ITX_MRX_N
    • DMI_ITX_MRX_P
    • DMI_MTX_IRX_N
    • DMI_MTX_IRX_P
    • DMI_MTX_IRX_P
    • CFG: MCH_CLKSEL,
    • MCH_CLKSEL, MCH_CLKSEL,
    • pm:  H_DPRSTP#
    • PM_SYNC#
    • H_THERMTRIP#
    • PM_DPRSLPVR
    • PM_EXTTS#
    • PM_EXTTS#
    • PLT_RST
    • misc: SDVO_SCLK
    • SDVO_SDATA, MCH_CLKREQ#
    • MCH_ICH_SYNC
    • had: HDA_BITCLK_MCH
    • HDA_RST_MCH#

GMCH Signals

Motherboard main signals and commands,

General Motherboard Switching system

FIRST RESET SIGNAL ON COMPUTER CIRCUIT

      • VALW / Power Always or MAIN DC POWER SUPPLY CIRCUIT LINE
      • RTC
      • AC Mode
      • DC  Mode

VS the Power Switch

  • VS POWER SUPPLY  for  BOOTSTRAP DEVICE :
  • VS for Strap Boot device
  • .SODIM/RAM  ( VCCRAM )
  • CHIP POWER ( VCCP )
  • VS to Device

Signal Processing

  • Microcontroller
  • BIOS
  • CHIP
  • Processor
  • Dell, HP, Acer, Apple, Toshiba, Samsung, and other laptop signals

UNDERSTANDING DIFFERENT SIGNALS OF DIFFERENT MOTHERBOARDS

  • Main signals of clock generator (xin, out, PWRDWN#, PWRGD#, PCI STP#, CPUSTP#, SCLK, SDATA, CLK VDD CPU.…)
  • Main signals of CPU Processor (VID O-5, VCCP, CPU, VCC CORE, VSS, HLOCK, CPU PWRGD ……)
  • Main signals of Northbridge (VCC, VCCHL VCCDV, VTTLF, VCCSM, DVOCD, DVOCCLK, MT2CCLK, DVICLK, DVICLK, PWROK, VSUS ……)
  • Main signals of South Bridge (VCPV, VCCLAN, VCCSUS, VSS, LCD1D, CLK66 ICH, CPU PWRGD, LPC, GPIO, IMVPOK, VCCPLL, V5REF….)
  • Main signals of Ethernet chips
  • Main signals of Sound audio Chip
  • (SHUTDOWN, VDD, PVDD1, PVDD2, LIN+…)
  • Main Signals Power Supply Chip
  • Main signals of MAIN POWER CHIP 5V, 3.3V  (PGOOD, DL2, DX2, CS2, FB2, ON1, ON2, VDD, BSTI, DH1, LX1, CS1, FB1….)
  • Main signals of  SECONDARY POWER SUPPLY CHIP  2.5, 1.5V  (—
  • Main signals of  CPU power supply chips:- (SYSPOK, PWROK, DPRSLPVR, DPSLP, VRON, VIN, VCC, VDD, OA+, OA-, DH, LX, DL, TON, FB, CSN, CSP…..)
  • Main signals of charging discharge control chip
  • Main signals of LVDS Section:
  • RTC signals
  • GRaphic Signals
  • Normal graphic
  • switchable graphic

SPI ROM and PCH ROM

  • Introduction to BIOS
  • Main Bios bios
  • EC /PCH Bios (embedded controller bios).\
  • ID Bios
  • Calculation of BIOS
  • Extracting
  • Bios Editing
  • Backup
  • Updating
  • EC BIOS Programming

BGA reballing L4

BGA reballing M4 Course Duration: 25Hrs

  • This is the final module of laptop chip level engineering students will get an opportunity to enter lab-v and sit at least 4,5 hours per day, students only exit from the institution after complete given task
  • IN this module we will learn about advanced signal analysis and command of laptop and desktop motherboard
  • BGA machine operation method
  • Proper Rebelling Process
  • Chip fixing and removing process
  • Intel, AMD, ATI, Nvdia, GMCH, ICH, PCH, and Processor
  • Microcontroller programming using SPI and Serial Programmer
  • Graphic Laptop to nongraphic conversation method
  • Circuit bypassing method
  • Signal tracing by Analogue Oscilloscope
  • Signal tracing by Digital  Oscilloscope

Advanced BIOS Repair

  • Preparation and Bios Edition (support programs and methods)
  • Preparation and Bios Edition (Decompression and Bios Region)
  • SIO Bios and the PCH Bios
  • ME Region (Intel) and manipulating the BIOS files
  • Bios Dell (Unpacking and Decryption)
  • Bios Asus (Structure, Unpacking, and Handling)
  • Bios Asus (Structure, Unpacking, and Handling)
  • Advanced Decompression Method (Update Bios)
  • HP Bios (Structure, Unpacking, and Handling)
  • Bios HP direct data injection in the Bios (Product ID, Serial Number)

CODING IC

  • Understand the coding ICS like CK=CE, DH=DJ EM=FM.
  • Equivalent IC and Chip

Course Features

  • 120 hours
  • Mid Level
  • 10
  • Yes

What you Get?

  • Well equipted lab
  • Highly experience instructor
  • Realtime project development
  • Internship in IT Industry
  • Job placement