Mobile Chip Level Training

Guru Institute of Engineering & Technology

Course Overview

We provide live professional chip level mobile training to repair all smart phones and tablets, which is supplemented by industrial smart phone service engineers with an updated syllabus through which even a matriculate can be made industry fit rather than a certificate holder.

The main target of Guru is to create technical expert and global entrepreneur to sustain in this competitive business world.

Basic Mobile Servicing M1

Basic Mobile Servicing Syllabus
Course Duration: 45Hrs

Introduction To Mobile Communication
History of mobile communication
GSM (Global System For Mobile Communication)
GSM &CDMA – Different bands
Duplexing – Uplink & Down Link Frequencies.
3G Network – WCDMA & CDMA 2000 ,4g networkingMultiplexing methods (Cellular Communication)
SDMA – Space Division Multiple Access _Cell Concept
FDMA –Frequency Division Multiple Access – Channels
TDMA – Time Division Multiple Access (Time Sharing)
CDMA – Code Division Multiple Access – spread spectrum method
Advantages And Disadvantages Of Cell ConceptNetworking (GSM CDMA & WCDMA)
Network Components – BTS, BSC, MSC, Link Towers – Repeaters
BTS – Base Transceiver Station, BSC – Base Station Controller
HLR ,VLR, EIR, SMSC, AUC, Voice Message Centre
Antenna – Low Power, High Power, Coverage, Repeater, Microwave Links
Power Variation in Antenna for Different Bands.
Auto Power Controlling In Mobile Phone According To Distance from BTS
Mobile initiated call – key of security – Diagram
Communication (link) between cellular network and other networks
Cell Broadcasting (CB), Cell Info DisplayIntroduction To Mobile Phone
Mobile Phone – IMEI Number
Manufacturing Companies And Mutual Understanding With Network Providers.
N/W Service Provider , N/W Technology Provider.
Transmitting Power Of Mobile Phone – GSM & CDMA
MS – Mobile Station – Mobile Phone + SIM
Securities Used In Mobile Phone For User [Security Code, Keypad Lock, Call Baring, Pattern lock],
Mobile phone pricing.

SIM – Subscriber Identity Module 
SIM – block diagram
SIM Contents, SIM Capacity, IMSI, PIN , PUK, Multi SIM packages
Working Voltage and clock for SIM.

Features Provided By N/W Provider 
SMS ,MMS, Voice Message, Call Barring, Call Diverting, Call Waiting ,Call Conferencing, Fixed Dialing ,CUG etc.
GPRS, EDGE, HSCSD, GPS Navigation Services, Television channels , Mobile Banking ,Tablet PC services

Different Modes Of Operations & Battery
Watch Dog – Purpose
Need Of Current Measurement In Service Field.
Main battery and RTC back up battery.
Sensing Points In Battery [Temperature, Over Voltage Etc.) & Complaints
Original And Duplicated Battery Comparison And Complaint Due To Duplicate Battery

Different Types Chargers
Types of chargers- travel, USB, Ampere rating of chargers
Minimum Voltage For Charging ,New Battery Charging
Battery Low Indication, Battery boosting, Cut off Circuit Using In Battery

SMT & SOC Systems – Revision
Current consumption , Temperature Handling , Soldering Details
MCP – (multichip packages) , Modules , BGA – Ball Grid Array, POP
Types Of BGA – Temperature Ratings
Multi Layer PCB’s

Integrated Circuits
DC to DC Converters , N/W IC’s, Microprocessor, Memory IC’s, sensors, Filters, MCP,MML
Bluetooth , Wi-Fi , FM IC’s, SIM, SIM EMIF (Glass IC-Diode Array, Resistor Array)
Pin Configuration of SMD IC’s

Types of BGA, Pin Configuration of BGA IC’s
Points Remember While Handling BGA
POP – Package On Package

Hardware Of Mobile Phones
Simple block diagram of mobile phone
Detailed block diagram
SOC(System on chip) ,Embedded System
Power Supply Section, N/W Section ,Data Processing Section
Display Section, UI Section (User interface Section)
Audio Section- Mic speaker, ringer, vibrator
Other wireless sections
Sensors in mobile phone

Basic Electronics M2

Basic Electronics
Course Duration: 30Hrs

Introduction to Electronics
Application of Electronics
Concept of matter 
Atomic structure
Conductor, Semi- conductor, Insulator
Electric charge, Potential difference, Electric current, Electrical energy, Electrical power
Measuring units
Types of current
Direct current, Alternating current
Wave length, Cycle, Frequency, Amplitude
Voltage Sources 
AC &DC voltage source
Measuring instruments, Multimeter
Ohm’s Law –simple Calculations
Voltage, Current, Resistance, Power Relations
Voltage & Current Measurement (breadboard)
Electronic Components 
Passive &Active Components
SMT- advantages
Fixed –types, Specifications
Variable –types
Colour coding
TDR (Thermister) ,LDR ,VDR
SMT resistors and Parallel & Series resistors
Current ,voltage measurement
Capacitance, Capacitor value
Capacitive Reactance
Specifications of Capacitor
Parallel & Series -coupling, filtering, bypassing
Fixed –Ceramic Capacitor, Mica Capacitor
Polyester Capacitor, Paper Capacitor
Electrolytic Capacitor (Aluminium, Tantalum)
Variable – types
SMT capacitors -Applications in Laptop (tank capacitor, EMIF, Sensor)
Dummy capacitors
Components checking using multimeter
Inductance, Inductive reactance
Self inductance & mutual inductance
Inductor- types (application base only)
Comparison between Capacitors & Inductors
Transformers, Specification
Step up Transformers, step down Transformers, Tapped Transformers
AC, chokes. Filters
SMT inductor and applications
Checking using Multimeter
FiltersSemi Conductors
N-Type & P-Type Semi Conductors
P-N junction, Biasing
Semi conductor Diodes
Diode – working, Specification
Classification of Diodes
Zener diode Voltage Regulator
SMT diodes and applications
Checking using Multi meter
Checking using by component Tester
DC Voltage source 
Primary & secondary cell
Voltage & current rating of CellCombination of cell
Battery- Series, & Parallel
Back up time & Charging time
Battery boosting
Battery -PPT
Types Of Battery, NiMH – NiCd, Li-Ion, Li-Polymer, Poly ascene.
Li-Ion & Li-Polymer – Protection Circuit
Advantages and Disadvantages.
AC to DC converter 
Rectifiers & filters
Different types of Rectifiers (Half wave & Full wave)
NPN & PNP Transistor
Transistor as a switch
Transistor as Amplifier
Different types of amplifiers – AF,RF,IF
Voltage amplifiers(pre-amp) and Power amplifiers
Multistage amplifiers (Ex: PA)
Tuned amplifiers
Comparison – FET, JFET & MOSFET
Advantages &disadvantages
SMT transistor-introduction and application
Checking using Multi meter

Integrated circuit 
Classification of IC , Advantages of IC
IC package – (PPT)
SOC, Multi chip package
Components array
Digital electronics 
Introduction (comparison between analog & digital)
Logic gates 
Flip- Flop, Multiplexers, De multiplexers
Memory- Classification
Flash Memory, OTP

Diagram/Schematic analysis M3

Diagram/Schematic analysis M3
Course Duration: 30Hrs

Charging section(all models)
Components Used In charging Section, Charging indication, charging controlling
Temperature sensing, BSI
Energy management IC
USB charging
Power management section
Power saving mode in mobile phone.
Components Used In Power Section
Power distribution, Core Voltages
DC- DC converters(SMPS IC), regulators
Block diagram of UEM, RETU, AVILMA and others
Temperature, Over Voltage and Low – Voltage Cutoff For Battery.
BSI, B-Temp Circuit on Board , Sensing Point Complaints
current sensing resister
Pull up and pull down resistor
On-Off Section Working (different models such as Nokia, Samsung, Sony Ericsson..))
Complaints Due To On-Off Circuit
RTC & Backup Battery
External Power Supply to Mobile Phone – Sensing Circuit
Tracing and Voltage checking
Complaints in charging and power sections
Block Diagram of Data Processing Section
CPU – Single engine, Dual engine
Different Processors –,Samsung, Sony , iphone, oppo
Single and Dual Operating Systems
Clock Signal For CPU – main crystal and RTC, CPU Speed
Core voltage supply
DSP – Digital Signal Processor , Block Diagram Of Digital Modulation
Memory section
RAM ,ROM,E2prom and Flash -common Complaints
MCP (multi chip packages) or MML (merged memory logic) or Combo memory.
Memory capacity checking from serial number
Internal mass Storage , Extended memory (Memory card section)
SIM section -SIM Related H/W Complaints , SIM Related Error Messages.Mobile Software’s
System Software (Operating System) – Types of operating systems
Dual engine operating systems (System OS + Application OS)
API (Application Peripheral Interfere) , Domestic OS (does not support API)
Data Exchange Software (PC suites)Mobile phone software upgrading
Service Software’s – Unlocking / Repairing
Flashing – different methods ,Flashing Boxes & Dongles,
Tracing and Voltage checking
Error Messages For H/W Complaints While Using Boxes
Network Section
Block Diagram explanation , Basic block diagram
RF Section and IF Section
Antenna , External Antenna, Antenna Switch (Tx / Rx),FEM
Pre-Amplifiers & RF Power Amplifier (TX)
LNA – RF Amplifiers ,RF Signal Processor
VCO,Supply To VCO
Crystal Oscillator , Frequency Synthesizer – working
Crystal ,Coil Filters ,Mutual Couplers(RF transformers)
Tracing and Voltage checking
Common Complaints
Audio Section
Explanation Of Audio Section In Different Models – Audio IC
MIC – Types, Crystal & Digital mic
Noise cancellation & multimedia mic
Speaker ,Ringer, Vibrator ,Audio amplifiers (ICs) ,Hands free – Types – WorkingDisplay Section
Liquid Crystal Display – LCD Drivers ,LCD Connectors
Organic Led (O Led) ,examples
Touchpad- types of touch pad(resistive, capacitive), Multy touch
Backlight driver circuit in different models
Back light brightness controlling (ambient light sensor)
Tracing and Voltage checking
Common complaints

Keypad Section 
Keypad, Backlight
Flip Keypad Activation
Joystick, Track ball, Touch Sensitive Keypad, optical touch pad
Camera Section
Camera –types ,camera working voltages
Resolution , digital &optical zooming
Camera flash light driver circuit
Hardware details
Tracing and Voltage checking
Common complaints

Advanced Technologies In Mobile Communication 
Convergent technology – TV, Projector, internet, GPS ……
Blue Tooth ,Wi-Fi, DLNA, Wi-Max
Wi-Fi hot spot in mobile phone
GPS & Navigation on Mobile phone
Short range wireless sections in mobile phone -Hard ware details
FM , Wi-Fi, Blue tooth, GPS
IPhone , Blackberry
Dead set repairing procedure
Data backup and recovery method

IC Reballing M4

BGA reballing M4
Course Duration: 25Hrs

In this module, students will get an opportunity to get internship in different mobile service centre inside valley and outside valley.
Checking Cell phone Schematic through advanced tools and softwares
EMMC programming
iPad Icloud Erasing

Course Features

  • Mid Level
  • Yes

What you Get?

  • Well equipted lab
  • Highly experience instructure
  • Realtime project development
  • Internship in IT Industry
  • Job placement