Mobile Phone Repair Training in Kathmandu with Advanced Chip Level Repairing Techniques
Mobile phone Repair Training in Nepal is the most relevant and necessary training in today’s world. As everyone carries mobile phones and trustful repairing is always an issue. In today’s world, it’s hard to find people without smartphones since it has been part of our life. With the pace of technology, there is a need for professionals who can address the issue. People always seek for a reliable place to find and solve the problem of new technology.
We provide the best mobile repair training in Kathmandu. We provide training in major cities like Pokhara, Dhangadi, Butwal and other cities. We provide reliable services to fix the problem. Guru has professional teachers and equipment to train students. GURU pioneers in Smart Technology and Engineering with a ‘Skill Development Program’. We providing opportunities to learn via live project exposures and real-time working culture. Guru is always head in mobile phone repair training in Kathmandu.
We follow the standard operating procedures “SOPs”. The device is checked, diagnosed, evaluated for cost. After that, the required services are executed. Software problem troubleshooting, hardware repair are executed. After that, test the faulty set and finally time stamp to claim the warranty period. We infix the latest version device software, firmware, repairing components. The component is resistors, capacitors, and IC (Integrated Circuit) chips from trusty vendors. We follow an international practice through which students can practice their skills anywhere. The students from GURU can compete around the world without getting biased.
We welcome everyone willing to join our academic training chip level repairing program. There is no bound to those willing to study. There are no criteria to join our program. Yet, a small skill test is conducted and counseling is done. The test is taken to help the students reach their goals and strengthen their weaknesses. After that classes of different modules are undertaken followed by the tests. Finally, the student is allowed to work as “On the Job Training” practitioner in a service center. Students here could master their mobile repairing skills in the relevant domain.
Mobile Phone Chip Level Training
We Break down our syllabus into four levels of mobile chip level Training. So that student feels easier in learning Mobile chip level training. They are explained below.
Service Level-I Mobile phone repair training
In this level of training, the student will replace all the internal and external parts. Students can fix problems related to mobile phones without any problem. Such as screen, battery, assemble, dissemble and identify the fault of different modules. This is the first level of mobile chip level training.
Service Level-II Mobile phone repair training
This is the second module of the mobile phone repairing course. In this module, a student will learn SMD components. Also, they learn to troubleshoot fault of electronics components also replaces faulty components.
Service level -III Mobile phone repair training
After completing the II module of mobile repair training, students can join the III level. Students can learn basic software to advanced level software. Students learn to use different dongles and the latest tools of software flashing.
Service Level – IV Mobile phone chip level repair training
This is the final module of the phone chip level course provides by GURU. In this module, students can learn the core chip level. They will also learn the schematic analysis of mobile phones. For this, they use different software and machines for mobile phone repairing. Students can replace BGA IC’s Touch IC’s and other BGA components.
Why choose Guru for Chip Level Repair Training
- Training in sophisticated devices and advanced handsets
- 100% job oriented courses on smart hardware and networking
- Molding each candidate to become a Techno Entrepreneur
- Achieved 100% Placement record in 2017/2018
- Building Technical manpower for nation-building
- 25+ Care centers all over Nepal and 3 Branches
- Scholarship for deserving candidates
- Real-time hands-on practical learning
- Career counseling and Guidance
What you’ll learn?
- Servicing in Card Level L1: 30 Hrs.
- Basic Electronics L2: 30 Hrs.
- Circuit/Schematic Analysis L3: 30 Hrs.
- BGA Rebelling L4: 30 Hrs.
Certification for Mobile Phone Repair Training
Upon the completion of training, Guru provides a letter of accomplishment for students. We provide placement for successful trainees.
Career Opportunities in Mobile Phone Repair Training
Every week new models of phones are launching and new mobile brands are rising up. Thus, there is no lack of workspace for ambitious mobile repair engineers. Smartphone repair engineers find lots of spaces to work after completing mobile repair training.
The triviality of this industry is also the result of increased internet and technology. Students will find more people being reliant on their phones as time passes by. It is all the information we need and our road to communication into this device. That is possible as well as practical to have mobile phone training in Kathmandu. If someone seeks to have a career with growth possible, then this is the right option for them. Some of the possible opportunities in Mobile Phone Repair training are pointed below:
- Freelance repair engineer
- Service Support Engineer
- Phone repair tech and consultant
- Smartphone repair shop
- Technical Support Engineer
- Start a repair shop of own
- General service center
- Tutor at any institute
- Servicing store of the cellphone company
Other core Mobile phone repair training services area
Deals with repairing of the branded mobile phones. Such as iPhone, Samsung Galaxy Series, MI, Micromax, MottoG, Oppo, Colors, LG, Nokia, Lenovo, etc.
Provide mobile software solutions. Such as the unlocking of mobile devices such as iPhone, Samsung Series, etc.
Experts in data recovery services of iPhone and other Android phones.
Provides Icloud solutions for apple devices such as iPhone, iPad, Mac
Provides repairing technicians as pay on-demand basis.
Provide the best opportunity to gain real-time experience in troubleshooting and fixing mobile.
Guru has a mission to enhance the youth in skill development programs.
Students learning at Guru are capable of establishing their own mobile technology business. 100% of the students are working in service centers in different places.
Students can work under a globally competent mobile repairing market.
Practical means profitable
Industry expert Mobile training instructors
Practice mobile repairing labs using the best equipment.
100% hands-on mobile phone repair training
Paid internship in our many guru care centers in Kathmandu and outside valley.
Repair circuits on the extra basis for the latest technology updates.
Share knowledge on reading schematics.
Why Mobile Repair Training in Kathmandu at GLabs?
Guru provides extensive specialization in professional mobile phone repair training. Experts at Guru are providing students the nectar of their years of experience in mobile repair. Students can handle all the mobile repairing problems while getting training on mobile at GLabs.
How Our Mobile Phone Repair training center is different than others?
- Mobile training at our center GLabs provides real-time hands-on works on industry live projects.
- We make sure the theory is well understood showing a real-time demonstration. We here teach in practical ways where they are to be implemented in projects
Students at our training center could get the realization of the real-time project. Also, work handling is like the operations executed in industries. With our industry-oriented globally updated syllabus, students would not get any significant challenges after joining the mobile training students. We provide opportunities to deserving students in different companies.
The students also get the opportunity to show their project works as part of tech talks. Students from GURU are in different honored companies around here in Kathmandu and other different cities.
How students can benefit from Mobile Phone Repair Training at GLabs?
With the growth of development in the digital world, every people carries mobile phones. As a good mobile repair expert, it is crucial to have knowledge related to mobile phones. In this regard, the trends in adopting the challenges of mobile repairing are becoming very popular.
The trends seem to be growing day by day as mobile products are revolving quite flexible. This is too attracting the students to learn mobile repair training. This seems to be one of the promising and growing IT carrier market. Guru is facilitating mobile training with the use of a very competitive syllabus and technology.
The specialty of GLabs – Mobile phone repair training center in Kathmandu
Well-equipped lab at GURU is advantages for the students learning the course. The experts here in GURU helps students learning in a sound environment. Competitive course content in GURU makes students learn quickly. The course content here makes students make adaptive in the market.
Future of Mobile Repair Training From GLabs – Guru Mobile Repair training center in Kathmandu
The future of Mobile Repair Training is one of the most promising fields in the IT industry. Guru Institute of Engineering & Technology is providing extensive services in this field. Apart from it, Guru specializes in mobile chip level training. Professional experts orient mobile repair training in the practical industry-based international syllabus.
Mobile Phone Repair training in Nepal is one of the most promising fields. Students at Guru are observed to get 100% placement in top mobile repair companies. Also, many students are abroad after gaining skills in our academics. Guru provides a rich level of mobile repair training in Kathmandu.
Mobile Chip Level training at GLabs – Mobile Phone Repair training in Kathmandu Nepal
Guru also provides mobile chip level training with a very competitive syllabus. With the specialized lab here in Guru, students can learn chip level training along with mobile phone repair training. The syllabus for this training is a breakdown in 4 levels. All these 4 levels are taught to students in very efficient ways.
We also give this course in various cities of Nepal. Students in Guru get live practical knowledge. This course leads students into wide space for job opportunities. Mobile repair training in Guru is one of the leading course among many courses. Students after getting chip level training can have 100% placements for sure. Also, they can compete in the global market, since the course standard is very relevant to the current time and situation.
Basic Mobile Servicing Syllabus
Course Duration: 45Hrs
History of mobile communication
GSM (Global System For Mobile Communication)
GSM &CDMA – Different bands
Duplexing – Uplink & Down Link Frequencies.
3G Network – WCDMA & CDMA 2000 ,4g networkingMultiplexing methods (Cellular Communication)
SDMA – Space Division Multiple Access _Cell Concept
FDMA –Frequency Division Multiple Access – Channels
TDMA – Time Division Multiple Access (Time Sharing)
CDMA – Code Division Multiple Access – spread spectrum method
Advantages And Disadvantages Of Cell ConceptNetworking (GSM CDMA & WCDMA)
Network Components – BTS, BSC, MSC, Link Towers – Repeaters
BTS – Base Transceiver Station, BSC – Base Station Controller
HLR ,VLR, EIR, SMSC, AUC, Voice Message Centre
Antenna – Low Power, High Power, Coverage, Repeater, Microwave Links
Power Variation in Antenna for Different Bands.
Auto Power Controlling In Mobile Phone According To Distance from BTS
Mobile initiated call – key of security – Diagram
Communication (link) between cellular network and other networks
Cell Broadcasting (CB), Cell Info DisplayIntroduction To Mobile Phone
Mobile Phone – IMEI Number
Manufacturing Companies And Mutual Understanding With Network Providers.
N/W Service Provider , N/W Technology Provider.
Transmitting Power Of Mobile Phone – GSM & CDMA
MS – Mobile Station – Mobile Phone + SIM
Securities Used In Mobile Phone For User [Security Code, Keypad Lock, Call Baring, Pattern lock],
Mobile phone pricing.SIM – Subscriber Identity Module
SIM – block diagram
SIM Contents, SIM Capacity, IMSI, PIN , PUK, Multi SIM packages
Working Voltage and clock for SIM.Features Provided By N/W Provider
SMS ,MMS, Voice Message, Call Barring, Call Diverting, Call Waiting ,Call Conferencing, Fixed Dialing ,CUG etc.
GPRS, EDGE, HSCSD, GPS Navigation Services, Television channels , Mobile Banking ,Tablet PC servicesDifferent Modes Of Operations & Battery
Watch Dog – Purpose
Need Of Current Measurement In Service Field.
Main battery and RTC back up battery.
Sensing Points In Battery [Temperature, Over Voltage Etc.) & Complaints
Original And Duplicated Battery Comparison And Complaint Due To Duplicate BatteryDifferent Types Chargers
Types of chargers- travel, USB, Ampere rating of chargers
Minimum Voltage For Charging ,New Battery Charging
Battery Low Indication, Battery boosting, Cut off Circuit Using In BatterySMT & SOC Systems – Revision
Current consumption , Temperature Handling , Soldering Details
MCP – (multichip packages) , Modules , BGA – Ball Grid Array, POP
Types Of BGA – Temperature Ratings
Multi Layer PCB’sIntegrated Circuits
DC to DC Converters , N/W IC’s, Microprocessor, Memory IC’s, sensors, Filters, MCP,MML
Bluetooth , Wi-Fi , FM IC’s, SIM, SIM EMIF (Glass IC-Diode Array, Resistor Array)
Pin Configuration of SMD IC’sBGA
Types of BGA, Pin Configuration of BGA IC’s
Points Remember While Handling BGA
POP – Package On PackageHardware Of Mobile Phones
Simple block diagram of mobile phone
Detailed block diagram
SOC(System on chip) ,Embedded System
Power Supply Section, N/W Section ,Data Processing Section
Display Section, UI Section (User interface Section)
Audio Section- Mic speaker, ringer, vibrator
Other wireless sections
Sensors in mobile phone
Basic Electronics M2
Course Duration: 30Hrs
Application of Electronics
Concept of matter
Conductor, Semi- conductor, Insulator
Electric charge, Potential difference, Electric current, Electrical energy, Electrical power
Types of current
Direct current, Alternating current
Wave length, Cycle, Frequency, Amplitude
AC &DC voltage source
Measuring instruments, Multimeter
Ohm’s Law –simple Calculations
Voltage, Current, Resistance, Power Relations
Voltage & Current Measurement (breadboard)
Passive &Active Components
Fixed –types, Specifications
TDR (Thermister) ,LDR ,VDR
SMT resistors and Parallel & Series resistors
Current ,voltage measurement
Capacitance, Capacitor value
Specifications of Capacitor
Parallel & Series -coupling, filtering, bypassing
Fixed –Ceramic Capacitor, Mica Capacitor
Polyester Capacitor, Paper Capacitor
Electrolytic Capacitor (Aluminium, Tantalum)
Variable – types
SMT capacitors -Applications in Laptop (tank capacitor, EMIF, Sensor)
Components checking using multimeter
Inductance, Inductive reactance
Self inductance & mutual inductance
Inductor- types (application base only)
Comparison between Capacitors & Inductors
Step up Transformers, step down Transformers, Tapped Transformers
AC, chokes. Filters
SMT inductor and applications
Checking using Multimeter
N-Type & P-Type Semi Conductors
P-N junction, Biasing
Semi conductor Diodes
Diode – working, Specification
Classification of Diodes
Zener diode Voltage Regulator
SMT diodes and applications
Checking using Multi meter
Checking using by component Tester
DC Voltage source
Primary & secondary cell
Voltage & current rating of CellCombination of cell
Battery- Series, & Parallel
Back up time & Charging time
Types Of Battery, NiMH – NiCd, Li-Ion, Li-Polymer, Poly ascene.
Li-Ion & Li-Polymer – Protection Circuit
Advantages and Disadvantages.
AC to DC converter
Rectifiers & filters
Different types of Rectifiers (Half wave & Full wave)
NPN & PNP Transistor
Transistor as a switch
Transistor as Amplifier
Different types of amplifiers – AF,RF,IF
Voltage amplifiers(pre-amp) and Power amplifiers
Multistage amplifiers (Ex: PA)
Comparison – FET, JFET & MOSFET
SMT transistor-introduction and application
Checking using Multi meterIntegrated circuit
Classification of IC , Advantages of IC
IC package – (PPT)
SOC, Multi chip package
Introduction (comparison between analog & digital)
AND, OR, NOT
Flip- Flop, Multiplexers, De multiplexers
RAM, ROM, EEPROM
Flash Memory, OTP
Diagram/Schematic analysis M3
Course Duration: 30Hrs
Components Used In charging Section, Charging indication, charging controlling
Temperature sensing, BSI
Energy management IC
Power management section
Power saving mode in mobile phone.
Components Used In Power Section
Power distribution, Core Voltages
DC- DC converters(SMPS IC), regulators
Block diagram of UEM, RETU, AVILMA and others
Temperature, Over Voltage and Low – Voltage Cutoff For Battery.
BSI, B-Temp Circuit on Board , Sensing Point Complaints
current sensing resister
Pull up and pull down resistor
On-Off Section Working (different models such as Nokia, Samsung, Sony Ericsson..))
Complaints Due To On-Off Circuit
RTC & Backup Battery
External Power Supply to Mobile Phone – Sensing Circuit
Tracing and Voltage checking
Complaints in charging and power sections
Block Diagram of Data Processing Section
CPU – Single engine, Dual engine
Different Processors –,Samsung, Sony , iphone, oppo
Single and Dual Operating Systems
Clock Signal For CPU – main crystal and RTC, CPU Speed
Core voltage supply
DSP – Digital Signal Processor , Block Diagram Of Digital Modulation
RAM ,ROM,E2prom and Flash -common Complaints
MCP (multi chip packages) or MML (merged memory logic) or Combo memory.
Memory capacity checking from serial number
Internal mass Storage , Extended memory (Memory card section)
SIM section -SIM Related H/W Complaints , SIM Related Error Messages.Mobile Software’s
System Software (Operating System) – Types of operating systems
Dual engine operating systems (System OS + Application OS)
API (Application Peripheral Interfere) , Domestic OS (does not support API)
Data Exchange Software (PC suites)Mobile phone software upgrading
Service Software’s – Unlocking / Repairing
Flashing – different methods ,Flashing Boxes & Dongles,
Tracing and Voltage checking
Error Messages For H/W Complaints While Using Boxes
Block Diagram explanation , Basic block diagram
RF Section and IF Section
Antenna , External Antenna, Antenna Switch (Tx / Rx),FEM
Pre-Amplifiers & RF Power Amplifier (TX)
LNA – RF Amplifiers ,RF Signal Processor
VCO,Supply To VCO
Crystal Oscillator , Frequency Synthesizer – working
Crystal ,Coil Filters ,Mutual Couplers(RF transformers)
Tracing and Voltage checking
Explanation Of Audio Section In Different Models – Audio IC
MIC – Types, Crystal & Digital mic
Noise cancellation & multimedia mic
Speaker ,Ringer, Vibrator ,Audio amplifiers (ICs) ,Hands free – Types – WorkingDisplay Section
Liquid Crystal Display – LCD Drivers ,LCD Connectors
Organic Led (O Led) ,examples
Touchpad- types of touch pad(resistive, capacitive), Multy touch
Backlight driver circuit in different models
Back light brightness controlling (ambient light sensor)
Tracing and Voltage checking
Common complaintsKeypad Section
Flip Keypad Activation
Joystick, Track ball, Touch Sensitive Keypad, optical touch pad
Camera –types ,camera working voltages
Resolution , digital &optical zooming
Camera flash light driver circuit
Tracing and Voltage checking
Common complaintsAdvanced Technologies In Mobile Communication
Convergent technology – TV, Projector, internet, GPS ……
GPRS EDGE ,HSCSD,3G
Blue Tooth ,Wi-Fi, DLNA, Wi-Max
Wi-Fi hot spot in mobile phone
GPS & Navigation on Mobile phone
Short range wireless sections in mobile phone -Hard ware details
FM , Wi-Fi, Blue tooth, GPS
IPhone , Blackberry
Dead set repairing procedure
Data backup and recovery method
BGA reballing M4
Course Duration: 25Hrs
iPad Icloud Erasing